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Tecnología & Video Juegos

3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers."

  • Duración: 00:38

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Science & Technology , IBM , 3M , 3D Semiconductors , towers , memory , networking , technology, vidoe